Multi-wafer ALD
Company Profile


System Introduction

    PEALD-B system is a multi-wafer deposition system specially designed for scientific research and industry exploitation in special application field. The electric of the system completely accords with the CE criterion. The system has expanded the choice range of precursor source, enhanced deposition rate of film, decreased deposition temperature, therefore, it’s widely used in film deposition of materials sensitive of temperature and films on soft substrate.


Product benefit

   Advanced software controlling system: many functions are integrated in the system,including technological formulation, parameter setting, popedom stetting ,interlocking alarming ad state supervisory control.


Technical specifications

Wafer Dimension

8 inch and below

Wafer temperature

RT-500,Controlling precision ±0.1

Number of precursor

Three precursor lines,optional more lines

Temperature of precursor lines

RT-200,Controlling precision ±0.1

Temperature of source bottles

RT-200,Controlling precision ±0.1

ALD Valve

Swagelok ALD swift valve

Background vacuum

<5*10-3Torr

Gas carrier system

N2 or Ar

Growing mode

Consecutive or interval deposition mode

Plasma souce

300W remote ICP discharge plasma

Gas source of plasma discharge

Three standard lines, optional more lines

Controlling system

PLC plus touch screen or display

Power supply

50-60Hz,220V/20A AC

Depositon Heterogeneity

Inside ship±1%,between chip ±1.5%

Thoughput capacity

500 wafers of 8 inch

Process time

5 s/cycle

Dimension of the instrument

1000mmx750mmx1600mm


ALD Films

Elementary substance: Co, Cu, Ta, Ti, W, Ge, Pt, Ru, Ni, Fe

Nitride: TiN, SiN, AlN, TaN, ZrN, HfN, WN

Oxide: TiO2, HfO2, SiO2, ZnO, ZrO2, Al2O3, La2O3, SnO2

Others: GaAs, AlP, InP, GaP, InAs, LaHfxOy, SrTiO3,SrTaO6

Application fields of ALD

High-k gate oxides

Storage capacitor dielectrics

High aspect ratio diffusion barriers for Cu interconnects

Pinhole-free passivation layers for OLEDs and polymers

Highly conformal coatings for MEMS applications

Coating of nanoporous structures

Doping of special fiber

Solar battery

Flat plate display

Optical thin-film

Nano film of other special structure